Staff are seen getting into Samsung Electronics’ workplace constructing in Seocho District, Seoul, Oct. 31. Yonhap
Samsung Electronics will broaden its semiconductor package deal amenities in South Chungcheong Province to spice up manufacturing of excessive bandwidth reminiscence (HBM) chips, firm officers mentioned Tuesday.
Underneath a memorandum of understanding with the provincial authorities, Samsung Electronics will convert an underused liquid crystal show plant owned by Samsung Show in Cheonan, some 85 kilometers south of Seoul, right into a semiconductor fabrication plant, in accordance with the officers.
The brand new amenities, anticipated to be accomplished by December 2027, will characteristic superior packaging strains for HBM chips, that are in excessive demand on account of their important function in AI computing.
Packaging is a essential stage of the semiconductor manufacturing course of that protects the chip from mechanical and chemical injury.
Samsung Electronics expects the upgraded amenities in Cheonan will assist the corporate regain a aggressive edge within the international semiconductor market.
The world’s largest reminiscence chipmaker has apparently fallen behind its native rival SK hynix within the HBM phase.
Samsung Electronics’ plans to produce its newest fifth-generation HBM3E merchandise to Nvidia have been delayed on account of high quality considerations. (Yonhap)
